Description
Materials, processing, and design of microelectronic ceramics are covered. Introduction to devices, triaxial ceramics, high aluminas, tape fabrication, metallizations, thick film processing, and glass-to-metal seals.
Learning Objective
- Understand the fundamental principles of microelectronic ceramics and their applications in modern technology.
- Analyze the properties and behavior of triaxial ceramics, including their mechanical, electrical, and thermal characteristics.
- Explore advanced manufacturing techniques such as tape fabrication, metallizations, and thick film processing specific to microelectronic ceramics.
- Develop the skills to design and engineer glass-to-metal seals for electronic components.
- Apply knowledge of materials, processing, and design to solve practical problems in the field of ceramics engineering.
Course Content
- Introduction to Microelectronic Ceramics
- Triaxial Ceramics
- High Aluminas
- Tape Fabrication Techniques
- Metallizations in Microelectronics
- Thick Film Processing
- Glass-to-Metal Seals
Course Evaluation Criteria